Our Commitment To Your Success

By providing our customers with the capabilities and purchasing power of a global Electronics Manufacturing Services provider while delivering the regional and personalized support best provided by a smaller company, we strive to build lasting relationships and create close and valued partnerships with our customers.

Our Mission

We understand that our success is predicated on our customer's success and are committed to a culture of hard work, integrity, and respect while fostering an entrepreneurial spirit that ingrains a sense of accountability and responsibility in all we do.

Our Capabilities - Your Competitive Advantage

Hybrids and Custom Micro-Electronic Assemblies

Custom assemblies for medical, security, military, telecom, solar, aviation, and space applications have been the backbone of our module and hybrid manufacturing activity for nearly 40 years. With the ability to choose from a variety of technologies OSI Electronics can offer a solution to most packaging challenges.

Some of the key building blocks in our technology include:
  • Wafer Sawing
  • Precision die placement
  • Automated wire bonding
  • Material dispensing
  • Multi-chip assemblies

PCB Assembly

With a high level of attention to detail, OSI Electronics' board assembly operations are tailored for exceptional flexibility to handle the varying process demands that our customers require. From high mix – low volume to high volume continuously running products, our facilities are equipped to handle the myriad of requirements the market brings.

Our systems are built around the following capabilities:
  • Automated modular lines
  • Dedicated NPI center
  • Advanced process controls
  • Automated conformal coating
  • In-circuit, functional, and environmental testing

Custom Cable Assemblies

OSI Electronics manufactures a wide range of custom cable assembly capabilities from simple connectorizing, to complex wire harness and molded cable assemblies using modern automated tools. OSI Electronics provides these services from our factories in Batam, Indonesia.

Automated high-volume processes include:
  • Cutting, stripping, tinning
  • Crimping and connectorizing
  • Overmolding and embedded circuitry
  • Complex harness assemblies

System Level and Box-build Assembly

From small modules and hand-held devices to large systems, OSI Electronics has the capability to manufacture a diverse range of custom product assemblies. Localizing the key supply chain elements and offering a hybrid production model option for cost optimization are strengths that we leverage to provide the lowest total product cost to our customers.

Our custom assembly know-how extends to:
  • Flexible lines for high mix production
  • Dedicated lines for high volume requirements
  • In-house boards, cables, and complete assembly and test