Our expertise in Medical, Aerospace/Military, and Telecommunications product manufacturing from components and board assemblies to complete systems, establishes a framework of high quality that encompasses all products we manufacture.

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OSI Electronics Equipment List Malaysia

OSI Electronics Main Equipment List

Thick-film Hybrid Modules

  • (2x) Semi-auto thick film metalization screen printers
  • (2x) BTU furnaces for ceramic firing
  • SMT screen printer
  • Mydata TP9 component placer
  • Heller 1700 Convection Reflow Machine

Chip-On-Board Lines

  • (2x) ASM896 Automatic die placer and epoxy dispenser
  • ASM Eagle 60 Automatic Au Wire Bonder
  • ASM 520A Automatic Al Wire Bonder
  • (2x) K&S 1470 Semi-automatic Al Wire Bonders
  • E&J Semi-automatic epoxy dispenser

Box-build Lines

  • Dedicated Medical Product box-build area
  • Integration and Final Assembly lines

Through-hole and Secondary Operations

  • Dual Wave Soldering Machine
  • Aqueous Cleaner
  • (4x) Manual Insert Lines
  • Hand Soldering,
  • Powder Coating

Test and Rework

  • Extensive engineering and test development capabilities
  • Custom test fixtures and set-ups
  • Trouble-shooting and Debug functions
  • Temperature Cycling, High-temp testing and Burn-in