By leveraging our core expertise in technology design and product development, and through our vertical integration and global manufacturing presence, we aim to lead the industry in providing the best, most advanced, and lowest cost products to the world.

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Hybrids and Custom Micro-Electronics Assemblies

Custom designs developed for medical, security, military, telecommunication, aviation and space applications have been the backbone of our module and hybrid manufacturing activity for nearly 30 years. With the ability to choose between a variety of technologies OSI can offer a solution to almost any packaging challenge.

Some of the key building blocks in our technology include:

  • Thin and thick film chip and wire
  • Thick film SMT with automated equipment
  • On board chip and wire
  • High precision placement
  • Extensive environmental, electrical, optical and functional testing capabilities